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How Innovations in DRAM Memory Architecture Promise to Raise Memory Throughput to 51.2GB/s
By Michael Ching Director, Product Marketing Group Rambus |
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Processor designers are working hard to satisfy demands from system developers and end-users, but increased processing throughput must be matched by improvements in memory bandwidth to deliver usable system-level performance gains. more >> |
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Logic non-volatile memory. Fully qualified at TSMC. 16b to 1Mb. more >> |
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Missed DAC this year? |
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Not to worry, you can still get the scoop on the latest IP trends. Simply click here to access presentations from over two dozen IP providers including ARM, Synopsys, True Circuits and Virage Logic, who spoke on the latest in semiconductor IP at IP Talks! |
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PCIe ASIC IP Cores |
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DDR3 + Hard PHY |
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Coding and Phy IP-cores |
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TCI PLLs and DDR DLLs are high quality, low jitter, silicon proven hard
macros. They are available in TSMC, UMC, CHRT and Common Platform processes
from 180nm to 40nm. Visit the timing experts at www.truecircuits.com.
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Will AMD separate manufacturing and design? The verdict is still out, with some industry experts for a fab spin off and some against it. Either way, AMD admits its recent promotion of Dirk Meyer as company CEO is... |
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UMC, Sematech partner to propel 300-mm technology To focus on R&D for exploratory technologies on 300-mm wafers, including the 22-nm manufacturing node and smaller process generations, Hsinchu, Taiwan-based... |
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MID-IC demand to climb Analysts expect global shipments of MIDs (mobile Internet devices) to skyrocket in the next four years, as will demand for the ICs in the small devices. Research from... |
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HDL-design challenges and philosophies for real-world ASIC... Prototyping with FPGAs works best if you do it with the final ASIC in mind. |
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Intel marches once again into microcontroller market Combining a single processor-core complex, North- and South-bridge functions, application-specific peripheral blocks, and in some cases an application accelerator,... |
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Applied Materials begins $17M Taiwan manufacturing center expansion The expansion aims to increase the company’s ability to meet demand for both its AKT flat panel display equipment and SunFab Thin Film Solar manufacturing equipment. |
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Nokia, Qualcomm settle all litigation, enter 15-year agreement Ending a bitter legal battle than spanned several continents, Nokia and Qualcomm ink an agreement covering various standards including GSM, EDGE, CDMA, WCDMA,... |
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IC Insights warns of disconnect between capital spending cuts, volume... Considering the strong unit growth rates being seen in memory and logic ICs, there simply isn’t much “wiggle room” for additional cuts in capital spending budgets at most... |
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MIPS inks new licensing agreements with PMC-Sierra According to MIPS, the code-compatible cores offer scalable solutions from entry-level designs to 1 GHz and beyond. |
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S3 delivers high performance mixed signal converter IP and analog subsystems proven in silicon from 0.18um to 65nm. This IP is trusted by leading IDM and fabless companies to reduce SoC design risks in Wireless Networking, (WiFi, 802.11a/b/g/n, WiMAX), Digital Mobile, Cable (DOCSIS, MOCA) and Broadcast TV applications. Choose our products for your next project on ChipEstimate.com. more >>
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